“无限未来”学术论坛 I Stacked Intelligent Metasurfaces: Communication, Computing and Sensing in the Wave Domain

发布者:何万源发布时间:2025-10-27浏览次数:14

Speech Title: Stacked Intelligent Metasurfaces: Communication, Computing and Sensing in the Wave Domain


时间/地点: 紫金山二楼报告厅2,2025年10月28日 星期二  9:15-10:15


Abstract: Next-generation wireless networks are expected to utilize the limited radio frequency resources more efficiently with the aid of intelligent transceivers. In this talk, we propose a recent transceiver architecture that relies on stacked intelligent metasurfaces (SIM). An SIM is constructed by stacking an array of programmable metasurface layers, where each layer consists of a massive number of simple meta-atoms that individually manipulate the electromagnetic waves. We provide an overview of SIM-aided MIMO transceivers, including their novelty, hardware architecture, and potential benefits over state-of-the-art solutions for communication, computing, and sensing applications.


Biography: Marco Di Renzo (Fellow, IEEE) received the Laurea (cum laude) and Ph.D. degrees in electrical engineering from the University of L’Aquila, Italy, in 2003 and 2007, respectively, and the Habilitation à Diriger des Recherches (Doctor of Science) degree from University Paris-Sud (currently Paris-Saclay University), France, in 2013. Currently, he is a CNRS Research Director (Professor) and the Head of the Intelligent Physical Communications group with the Laboratory of Signals and Systems (L2S) at CNRS & CentraleSupélec, Paris-Saclay University, Paris, France, as well as a Chair Professor in Telecommunications Engineering with the Centre for Telecommunications Research - Department of Engineering, King’s College London, London, United Kingdom. He was a France-Nokia Chair of Excellence in ICT at the University of Oulu (Finland), a Tan Chin Tuan Exchange Fellow in Engineering at Nanyang Technological University (Singapore), a Fulbright Fellow at The City University of New York (USA), a Nokia Foundation Visiting Professor at Aalto University (Finland), and a Royal Academy of Engineering Distinguished Visiting Fellow at Queen’s University Belfast (U.K.). He is a Fellow of the IEEE, IET, EURASIP, and AAIA; an Academician of AIIA; an Ordinary Member of the European Academy of Sciences and Arts, an Ordinary Member of the Academia Europaea; an Ambassador of the European Association on Antennas and Propagation; and a Highly Cited Researcher. His recent research awards include the Michel Monpetit Prize conferred by the French Academy of Sciences, the IEEE Communications Society Heinrich Hertz Award, and the IEEE Communications Society Marconi Prize Paper Award in Wireless Communications. He served as the Editor-in-Chief of IEEE Communications Letters from 2019 to 2023. His current main roles within the IEEE Communications Society include serving as a Voting Member of the Fellow Evaluation Standing Committee, as the Chair of the Publications Misconduct Ad Hoc Committee, and as the Director of Journals. Also, he is on the Editorial Board of the Proceedings of the IEEE.



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